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Kulicke & Soffa 4526

 

K&S Model 4526
  • Independent Manual Z-axis control, separate from X and Y axis control.
  • Independently adjustable Wire Parameters
    - Separate Force control for each bond, adjustable and independent per channel.
    - Separate Bond Time control for each bond.
    - Separate Bond Power control for each bond.
  • No springs are used to apply bond force; digitally controlled components are utilized.
  • Standard bonding , Deep Access and Ribbon bonding with same Bond Head “tool assembly”.
    No need to change “tool assembly".
  • Motorized Wire Clamp Motion with Linear Stepper Motor
  • Auto-Stepback Mode is included, with a motorized Y stage.
  • Stitch Mode is included.
  • No vacuum or air pressure is required for operation.
  • Standard Reset Height is .260” with full range fine Z Motion control.
  • High Reset Height is .500” for tall package clearance.
  • Wire Sizes are from .0007” dia., to .003” dia. (18 – 75 Micron Diameter) Aluminum and Gold.
  • Ribbon Sizes are up to .001” x .010” (gold).

 

For more info see this link http://www.kns.com/kns/mwb_wedge_analog.asp

 

 

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K&S 798

 
Like New 8" wafer saw complete with integrated cleaner
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MA 1100 Wafer Saw ***Sold***

MA 1100.jpg

SOLD

Wafer Dicing Saw Model: 1100 Wafer dimension: 4" Wafer thickness: 1 mil to 500 mils Spindle speed: 15,000 to 40,000 RPM Program storage capacity: 60 standard programs Power required: 110/220VAC, 1500W, 50/60Hz Air required: 65 PSI min, 6 CFM Vacuum required: 20" Hg min, 2 CFM Water required: 66 GPH
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K&S 1419 DAWN II Automatic Ball Bonder

1419 Dawn.jpg
Ball Bonder. Wire Sizes: 1.0 to 20 mil. Max. wires per bonding program: IC - 70 wires hybrid - 600 wires or 2,500 wires software dependent 2” Spool dia. Very Good Condition.
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