Sunshine Semiconductor, Inc.

K&S 1470 Automatic Wedge Bonder

Wedge Bonder Series B Automatic Heavy Wire Bonder. B&L Stereozoom #4 microscope.Model 4430 Floppy Disk System.Aluminum wire: size range: 1.0 to 2.0 mils. .Programmable bonding parameters: Bond force: 25 to 125 grams; Bond time: 1 to 999 ms. .X-Y table: Bonding area: 3 5/8” x 4”
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K&S 4123

Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids w/height variations up to 200 mils. Wire diameter range: Gold, 0.5 to 3.0 mil. Aluminum, 1.0 to 3.0 mil. Spool size: TC-1 0.5”. Requires 120V, 60 Hz.
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K&S 4124

Ball Bonder. The Model 4124 is a gold wire ball bonder that is versatile enough to bond simple ICs and discrete devices, or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Built-in electronic flame-off with ball size adjusting dial. Electronically controlled loop height dial on front panel. Electronically controlled tail length. Wire dia. range: Gold 0.7 to 3.0 mil. Bond Force:20 to 160 grams Bond Time: 10 to 100ms.
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K&S 4523 A Digital

Wedge Bonder Standard access and deep access in one machine. Digital Option, Auto stepback option installed, can be upgraded to vertical access with little expense. call for more details
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